Not known Facts About Noohapou
Not known Facts About Noohapou
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The POU3500 system offers dynamic temperature control of the process chamber cathode / electrode / anode and can be synchronized with any etch course of action.
30% of its peak power intake, supplying our shoppers important reduction in working charges and elevated reliability.
the knowledge down below is categorized by semiconductor course of action and Software company. Every single table features an apps Matrix that demonstrates qulified and commercial procedures.
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This exceptional method, providing a little sort factor, inexpensive-of-Ownership and Dynamic Temperature Command presented course of action and gear engineers a completely new Device to enhance their temperature delicate procedures.
The precision with the POU 3300 permits independent Charge of the process fluid temperature on the wafer chuck in just +/- 0.1 °C of set point, plus the rapidly response website time from the program lets for max wafer-to-wafer repeatability throughout the etch method.
The precision of your POU 3500 permits unbiased Charge of the process fluid temperature to your wafer chuck within just +/- 0.one °C of set stage, and also the quickly reaction time of the program makes it possible for for maximum wafer-to-wafer repeatability through the etch process.
With all the POU3300, you can reach unprecedented ends in etch effectiveness, chamber uptime, diminished expense of ownership and fab space utilization – all when strengthening your method dependability.
huge Footprint: Static units occupy considerable House within the fabrication Resource place, decreasing its efficiency.
Dynamic Temperature Command, as executed in devices like the LAUDA-Noah POU, is an strategy that senses the temperature of the procedure fluid coming back from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature on the equipped course of action fluid based upon this real-time responses.
The TEs' can switch straight from heating to cooling, or visa-versa. They can activate & off even though within the heating or cooling manner and will enhance or decrease the amount of heating or cooling with out switching in any respect.
in excess of at any time, shrinking product geometries, demanding new processes and a extremely aggressive ecosystem require temperature Command units that Mix quickly and exact temperature Management with an emphasis on lessened operating expenses and enhanced trustworthiness.
the truth is usually that accurate Dynamic Temperature Control can only be realized when all five (5) of the next process design and style and set up specifications are met:
(as a result, putting in a static device beside chamber will never help it to deliver dynamic temperature Manage)
We need a lot less cooling/heating ability for a similar software for a static TCU thanks to our tiny reservoir volume.
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